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手机版 |
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产品描述
用于对切割缝隙要求比较小的手机面板及多晶硅等产品。主要厚度:0.3mm,0.4mm 外径尺寸和中孔安装尺寸可根据用户要求定制。
Used for mobile phone panels and polycrystalline silicon products that require relatively small cutting gaps.Main thickness:0.3mm,0.4mm,outer diameter size and middle hole installation size can be customized according to user requirements.